Nestlé and IBM Collaborate on AI Tool for High-Barrier Packaging Discovery

 

Researchers explore AI-driven approaches to develop advanced packaging solutions.

 

 

Nestlé has partnered with IBM Research to advance packaging innovation using artificial intelligence and deep technology. The collaboration focuses on developing a generative AI tool designed to identify new high-barrier packaging materials that protect sensitive food and beverage products.

 

 

Through this partnership, scientists from both organizations constructed a knowledge base of existing packaging materials using public and proprietary documents. A chemical language model was then trained on this curated data, enabling it to understand molecular structures. IBM’s regression transformer was subsequently applied to correlate structural features with physical and chemical properties, allowing the model to propose novel packaging materials.

 

 

These materials aim to provide enhanced protection against moisture, temperature fluctuations, and oxygen exposure. Nestlé plans to use this AI tool to identify potential future packaging options that balance cost, recyclability, and performance.

 

 

Stefan Palzer, Nestlé’s Chief Technology Officer, stated, “This novel AI-powered language model, developed in collaboration with IBM Research, illustrates how Nestlé is leading the digital transformation within the food and beverage industry. In the future, such breakthrough technology could be used to optimize the development of more sustainable packaging solutions across product categories.”

 

 

IBM Research VP Europe & Africa, Alessandro Curioni, added, “We do believe that Generative AI will continue to disrupt scientific discovery, impacting the core business of all knowledge-based industries, allowing critical differentiation and sustainable growth.”

 

 

This initiative is part of Nestlé’s broader strategy to leverage digital tools such as AI, machine learning, and automation. The company recently announced the opening of a dedicated R&D center for deep tech, which will support further research into advanced technologies including sensors, robotics, and digital simulation tools.