Avery Dennison has announced the first mass-scale integration of Pragmatic Semiconductor’s flexible integrated circuit (FlexIC), NFC Connect PR1301, into its Near Field Communication (NFC) inlay portfolio, marking a development in smart packaging and intelligent labelling.
The innovation centres on replacing conventional rigid silicon chips with an ultra-thin, flexible integrated circuit that can be embedded into NFC inlays and applied directly onto packaging, including curved or irregular surfaces. This enables secure, smartphone-tap interactions with consumer packaged goods while maintaining compatibility with high-volume production environments.
The NFC Connect PR1301 provides item-level intelligence at lower cost, supporting wider deployment of NFC inlays across retail and healthcare packaging. By integrating flexible NFC functionality at scale, the companies aim to make connected packaging more commercially viable for mass-market applications, including product authentication, consumer engagement and compliance requirements such as Digital Product Passports (DPP).
In addition to design flexibility, Pragmatic Semiconductor stated that its manufacturing process uses less chemicals, energy and water compared to traditional silicon chip production, addressing sustainability considerations in semiconductor supply chains linked to packaging technologies.
Mathieu De Backer, VP Intelligent Labels Innovation at Avery Dennison, said the company is ready to mass produce products incorporating Pragmatic NFC Connect to support reliable connectivity for clients. James Davey, SVP sales, business development and product management at Pragmatic Semiconductor, noted that the integration enables expansion of NFC functionality into new packaging formats.
The development reflects increasing demand for scalable, flexible NFC inlays as brands seek to embed digital connectivity directly into packaging structures.